How does OSAAP Eliminate FOD Conditions With ESD Safe Foam?

Our ESD Foam is closed cell and cross linked material.  The cells get opened during the milling process and can create a FOD condition by exposing a rough edge with small pieces that could break off.

Heat will seal the edge and eliminate the FOD condition.  OSAAP America heat treats our ESD foam a heat gun set at 1000°F before shipment.

Close-up Before Heat Process
Close-up After Heat Process:
Full Board After Heating